E8 262: CAD for High Speed Chip-Package-Systems (3:0)

Instructor: Dipanjan Gope





Lecture 1: Types of Packages and System Level Trends (slides)

Lecture 2+3: Signal Integrity, Power Integrity, EMI Introduction (slides)

Lecture 4+5: Review of Circuit Simulation/SPICE (slides)

Lecture 6: (2D) Transmission Line Basics (handnotes)

Lecture 7: (2D) Transmission Line Basics + Two conductor Tx Lines(handnotes)

Lecture 8: (2D) Two conductor Tx Lines: per unit length parameters (handnotes)

Lecture 9+10: (2D) Two conductor Tx Lines: Frequency domain analysis (handnotes) (HSPICE SI Reference)

Lecture 11: (2D) Two conductor Tx Lines: Time domain analysis(handnotes)

Lecture 12: (2D) Multiconductor Tx Lines: Eqn and pul(handnotes)

Lecture 13: (2D) Multiconductor Tx Lines: Freq and Time domain analysis(handnotes)

Lecture 14: Power Integrity: DC Analysis (handnotes)

Lecture 15: PDN DC Analysis: Multigrid based solution (handnotes) ( Multigrid Tutorial)

Lecture 16: (2.5D) PDN AC Analysis: Multilayered Finite Difference Method (handnotes)

Lecture 17: (3D) PEEC Analysis: Quasistatic conductor (handnotes)

Lecture 18: (3D) PEEC Analysis: Fullwave and Dielectrics (handnotes)

Lecture 19+20: (3D) PEEC Analysis: Surface PEEC and Frequency Stability (handnotes)